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Product Overview

The OSI light source module is another technical invention created by WPL for the detection of cell defects.

The laser wavelength adopts a near-infrared laser light source, which is matched with a high-definition line scanning camera and mainly used to detect defects such as hidden cracks, dirty, broken edge in raw silicon wafers, process wafers, and cells.

The highly innovative OSI light source module can achieve simultaneous detection of multiple defects in one workstation.

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Application Scenarios

The OSI adopts near-infrared laser light source for non-contact defect detection,
which is applicable to all sorting processes from raw silicon wafers, process wafers to modules, and can realize simultaneous detection of broken edges and corners as well as hidden cracks.
Raw silicon wafer
Texturing
Etching
Coating film
Screen printing
Post-EL

Technical Advantages

The OSI adopts infrared laser technology, which has significant directional characteristics that make it extremely penetrating. While detecting hidden cracks, it can also detect many defects such as broken edges, and dirty.
The OSI can be optically redesigned and optimized for different user sites due to good laser directionality, with unlimited space requirements.
The unique optical shaping technology of the OSI ensures excellent uniformity and delicacy of the overall image.

Product List

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 Spec
Search results：
Default
PERC TOPCon HJT
Raw silicon wafer Texturing Back-PE Front-PE Screen Printing Post-furnacing Post-EL
166 182 210 230
L T Z Convex Split-Type Others
≥3600 ≥10000
  • 1
    O-12CA-C7Q6S-V5B
    TOPCon、HJT、PERC
    Raw silicon wafer
    166、182、230、210
    Convex
    ≥3600
    Spec
  • 2
    O-12CA-E7Q6S-V5B
    PERC、TOPCon、HJT
    Texturing、Back-PE、Front-PE、Screen Printing、Post-furnacing、Post-EL
    166、182、210、230
    Convex
    ≥3600
    Spec
  • 3
    O-12CA-E8X6S-V1B
    PERC、TOPCon、HJT
    Texturing、Back-PE、Front-PE、Screen Printing、Post-furnacing、Post-EL
    166、182、230、210
    Split-Type
    ≥3600
    Spec
  • 4
    O-12CA-C84X-V3.2B
    PERC、TOPCon、HJT
    Raw silicon wafer
    166、182、210、230
    Z
    ≥3600
    Spec
  • 5
    O-12CA-E84X-V1.1B
    HJT、TOPCon、PERC
    Texturing、Back-PE、Front-PE、Screen Printing、Post-furnacing、Post-EL
    166、182、210、230
    L
    ≥3600
    Spec
  • 6
    O-12CA-E8X6S-V6B
    PERC、TOPCon、HJT
    Texturing、Back-PE、Front-PE、Screen Printing、Post-furnacing、Post-EL
    166、182、210、230
    Split-Type
    ≥3600
    Spec
  • 7
    O-12CA-C8X6S-V6B
    PERC、TOPCon、HJT
    Raw silicon wafer
    166、182、230、210
    Split-Type
    ≥3600
    Spec
  • 8
    O-12CA-C7Q6S-V5.2B
    PERC、TOPCon、HJT
    Raw silicon wafer
    166、182、210、230
    Convex
    ≥3600
    Spec
  • 9
    O-12CA-C7B6S-V5.1B
    PERC、TOPCon、HJT
    Raw silicon wafer
    166、182、210、230
    Convex
    ≥3600
    Spec
  • 10
    O-12CA-C846S-V5B
    PERC、TOPCon、HJT
    Raw silicon wafer
    166、182、210、230
    Convex
    ≥3600
    Spec
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WPL Beijing Ltd.

  • Address: 2F Tower B,Huari Bldg, Keyuan Rd 3#,Daxing Dist, Beijing, P.R.China
  • 电话：+86 10 60219971
  • 传真：+86 10 60219971
  • E-mail：sales@w-plaser.com

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